HTC555 NIE555, Elektronika, NE555, Datasheat
[ Pobierz całość w formacie PDF ]
HIGH TECH
CHIPS, INC.
GENERAL PURPOSE CLOCK GENERATOR
1.0
General description
.
HTC555 is a general-purpose clock generator. It requires no
external components and provides wide range of clock
frequencies. It’s very easy to use and provides general clock
solution in wide range of applications. It is very simple to design
and operate. Output frequency is determined by value of D[0:4].
Refer to Output frequency table.
PDIP, SOIC
1
VDD GND
CLKOUT D0
D4
8
2
7
3
D1
6
4
D3
D2
5
Features
HTC555
Single chip solution.
Replaces clock generator.
Has one percent frequency accuracy at room temperature.
Has ten percent frequency accuracy over temperature range and VDD voltage range.
Requires no external components for operation.
2.0 Application.
Typical connection diagram.
VDD
VDD
R1
R2
R3
R4
R5
C1
100n
10K
10K
10K
10K
10K
HTC555
1
2
3
4
5
10
9
8
7
6
7
D0
VDD
1
CLOCK OUTPUT
6
D1
5
2
D2
CLKOUT
4
D3
3
D4
GND
8
FREQUENCY SELECTION
01/04/00
1
HIGH TECH
CHIPS, INC.
With this application we can generate thirty-two different output frequencies. See output frequency
selection table for dip switch settings. Setting “Frequency Selection” dip switch sets frequency.
HTC555 reads input switch value constantly and output frequency is set per new value if D[0:4] inputs
are changed. Time that takes to change output frequency to new value is relative to period of
previous frequency setting. For example if HTC555 was generating 10000Hz clock and we changed it
to 25000Hz clock, then output frequency will change in 1/10000Hz or 100uS. In order to avoid output
glitches, HTC555 changes its output frequency after finishing current output period. R1-R5 value
could be in a range of 1K to 10K in this application. Please note that if only one frequency is needed
then we can connect D [0:4] pins directly to ground or VDD. C1 is used, as de-coupling capacitor and
could be omitted.
3.0 Pin out description.
Abbreviations used: O - output, I - input, P - power.
Pin number
Name
I / O Description
Notes
1
VDD
P Power
+2.5V to + 5.5V.
2
CLKOUT
O Clock Output
Output frequency.
3
D4
I
Frequency selector input.
Tie to GND or VDD.
4
D3
I
Frequency selector input.
Tie to GND or VDD.
5
D2
I
Frequency selector input.
Tie to GND or VDD.
6
D1
I
Frequency selector input.
Tie to GND or VDD.
7
D0
I
Frequency selector input.
Tie to GND or VDD.
8
GND
P Ground
Connect to ground.
Output Frequency Selection.
Abbreviations used: 0 – connection to GND, 1 – connection to VDD.
D4 D3 D2 D1 D0
CLK ( output frequency)
00000
z
0
0
0
0
1
10 Hz
0
0
0
1
0
20 Hz
0
0
0
1
1
30 Hz
0
0
1
0
0
40 Hz
0
0
1
0
1
50 Hz
0
0
1
1
0
60 Hz
0
0
1
1
1
70 Hz
0
1
0
0
0
80 Hz
0
1
0
0
1
90 Hz
0
1
0
1
0
100 Hz
0
1
0
1
1
200 Hz
0
1
1
0
0
300 Hz
0
1
1
0
1
400 Hz
0
1
1
1
0
500 Hz
01/04/00
2
HIGH TECH
CHIPS, INC.
0
1
1
1
1
600 Hz
1
0
0
0
0
700 Hz
1
0
0
0
1
800 Hz
1
0
0
1
0
900 Hz
1
0
0
1
1
1000 Hz
1
0
1
0
0
2000 Hz
1
0
1
0
1
3000 Hz
1
0
1
1
0
4000 Hz
1
0
1
1
1
5000 Hz
1
1
0
0
0
6000 Hz
1
1
0
0
1
7000 Hz
1
1
0
1
0
8000 Hz
1
1
0
1
1
9000 Hz
1
1
1
0
0
10000 Hz
1
1
1
0
1
25000 Hz
1
1
1
1
0
50000 Hz
1
1
1
1
1
100000 Hz
4.0 Electrical characteristics.
Voltage on VDD pin in respect to GND
+2.5 to +5.5V
Current consumption with no load attached
3 mA
1
0.4V
1
CLKOUT
output low voltage (5mA load)
0.75V
1
CLKOUT
output low voltage (25mA load)
CLKOUT
output high voltage (5mA source)
VDD-0.7V
1
CLKOUT
output source current max
25mA
1
CLKOUT
output sink current max
25mA
1
NOTES:
1. Those values are characterized but not tested
.
5.0
Ordering information.
HTC5 5 5XX
OPTIONAL: Temperature range:
C = 0
o
C to +70
o
C , I = - 40
o
C to + 85
o
C.
PACKAGE:
S – 208 mil SOIC
D – 300 mil PDIP.
PART NUMBER.
01/04/00
3
HIGH TECH
CHIPS, INC.
6.0 Mechanical information.
8-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
Units
INCHES*
MILLIMETERS
Dimension Limits MIN
NOM
MAX
MIN
NOM
MAX
Number of Pins
n
8
8
Pitch
p
.100
2.54
Top to Seating Plane
A
.140
.155
.170
3.56
3.94
4.32
Molded Package Thickness
A2
.115
.130
.145
2.92
3.30
3.68
Base to Seating Plane
A1
.015
0.38
Shoulder to Shoulder Width E
.300
.313
.325
7.62
7.94
8.26
Molded Package Width
E1
.240
.250
.260
6.10
6.35
6.60
Overall Length
D
.360
.373
.385
9.14
9.46
9.78
Tip to Seating Plane
L
.125
.130
.135
3.18
3.30
3.43
Lead Thickness
c
.008
.012
.015
0.20
0.29
0.38
Upper Lead Width
B1
.045
.058
.070
1.14
1.46
1.78
Lower Lead Width
B
.014
.018
.022
0.36
0.46
0.56
Overall Row Spacing
eB
.310
.370
.430
7.87
9.40 10.92
Mold Draft Angle Top
5
10
15
5
10
15
Mold Draft Angle Bottom
5
10
15
5
10
15
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash protrusions. Mold flash or protrusions shell
not exceed .010” (0.254mm)per side.
JEDEC Equivalent:MS-001
01/04/00
4
HIGH TECH
CHIPS, INC.
8-Lead Plastic Small Outline (SM) – Medium, 208 mil (SOIC)
Units
INCHES
*
MILLIMETERS
Dimension Limits MIN
NOM
MAX
MIN
NOM MAX
Number of Pins
n
8
8
Pitch
P
.050
1.27
Overall Height
A
.070
.075
.080
1.78
1.97 2.03
Molded Package Thickness A2
.069
.074
.078
1.75
1.88 1.98
Standoff
A1
.002
.005
.010
0.05
0.13 0.25
Overall Width
E
.300
.313
.325
7.62
7.95 8.26
Molded Package Width
E1
.201
.208
.212
5.11
5.28 5.38
Overall Length
D
.202
.205
.210
5.13
5.21 5.33
Foot Length
L
.020
.025
.030
0.51
0.64 0.76
Foot Angle
0
4
8
0
4
8
Lead Thickness
c
.008
.009
.010
0.20
0.23 0.25
Lead Width
B
.014
.017
.020
0.36
0.43 0.51
Mold Draft Angle Top
0
12
15
0
12
15
Mold Draft Angle Bottom
0 12
15
0
12
15
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash protrusions. Mold flash or
protrusions shell not exceed .010” (0.254mm)per side.
01/04/00
5
[ Pobierz całość w formacie PDF ]
zanotowane.pl doc.pisz.pl pdf.pisz.pl chiara76.opx.pl
HIGH TECH
CHIPS, INC.
GENERAL PURPOSE CLOCK GENERATOR
1.0
General description
.
HTC555 is a general-purpose clock generator. It requires no
external components and provides wide range of clock
frequencies. It’s very easy to use and provides general clock
solution in wide range of applications. It is very simple to design
and operate. Output frequency is determined by value of D[0:4].
Refer to Output frequency table.
PDIP, SOIC
1
VDD GND
CLKOUT D0
D4
8
2
7
3
D1
6
4
D3
D2
5
Features
HTC555
Single chip solution.
Replaces clock generator.
Has one percent frequency accuracy at room temperature.
Has ten percent frequency accuracy over temperature range and VDD voltage range.
Requires no external components for operation.
2.0 Application.
Typical connection diagram.
VDD
VDD
R1
R2
R3
R4
R5
C1
100n
10K
10K
10K
10K
10K
HTC555
1
2
3
4
5
10
9
8
7
6
7
D0
VDD
1
CLOCK OUTPUT
6
D1
5
2
D2
CLKOUT
4
D3
3
D4
GND
8
FREQUENCY SELECTION
01/04/00
1
HIGH TECH
CHIPS, INC.
With this application we can generate thirty-two different output frequencies. See output frequency
selection table for dip switch settings. Setting “Frequency Selection” dip switch sets frequency.
HTC555 reads input switch value constantly and output frequency is set per new value if D[0:4] inputs
are changed. Time that takes to change output frequency to new value is relative to period of
previous frequency setting. For example if HTC555 was generating 10000Hz clock and we changed it
to 25000Hz clock, then output frequency will change in 1/10000Hz or 100uS. In order to avoid output
glitches, HTC555 changes its output frequency after finishing current output period. R1-R5 value
could be in a range of 1K to 10K in this application. Please note that if only one frequency is needed
then we can connect D [0:4] pins directly to ground or VDD. C1 is used, as de-coupling capacitor and
could be omitted.
3.0 Pin out description.
Abbreviations used: O - output, I - input, P - power.
Pin number
Name
I / O Description
Notes
1
VDD
P Power
+2.5V to + 5.5V.
2
CLKOUT
O Clock Output
Output frequency.
3
D4
I
Frequency selector input.
Tie to GND or VDD.
4
D3
I
Frequency selector input.
Tie to GND or VDD.
5
D2
I
Frequency selector input.
Tie to GND or VDD.
6
D1
I
Frequency selector input.
Tie to GND or VDD.
7
D0
I
Frequency selector input.
Tie to GND or VDD.
8
GND
P Ground
Connect to ground.
Output Frequency Selection.
Abbreviations used: 0 – connection to GND, 1 – connection to VDD.
D4 D3 D2 D1 D0
CLK ( output frequency)
00000
z
0
0
0
0
1
10 Hz
0
0
0
1
0
20 Hz
0
0
0
1
1
30 Hz
0
0
1
0
0
40 Hz
0
0
1
0
1
50 Hz
0
0
1
1
0
60 Hz
0
0
1
1
1
70 Hz
0
1
0
0
0
80 Hz
0
1
0
0
1
90 Hz
0
1
0
1
0
100 Hz
0
1
0
1
1
200 Hz
0
1
1
0
0
300 Hz
0
1
1
0
1
400 Hz
0
1
1
1
0
500 Hz
01/04/00
2
HIGH TECH
CHIPS, INC.
0
1
1
1
1
600 Hz
1
0
0
0
0
700 Hz
1
0
0
0
1
800 Hz
1
0
0
1
0
900 Hz
1
0
0
1
1
1000 Hz
1
0
1
0
0
2000 Hz
1
0
1
0
1
3000 Hz
1
0
1
1
0
4000 Hz
1
0
1
1
1
5000 Hz
1
1
0
0
0
6000 Hz
1
1
0
0
1
7000 Hz
1
1
0
1
0
8000 Hz
1
1
0
1
1
9000 Hz
1
1
1
0
0
10000 Hz
1
1
1
0
1
25000 Hz
1
1
1
1
0
50000 Hz
1
1
1
1
1
100000 Hz
4.0 Electrical characteristics.
Voltage on VDD pin in respect to GND
+2.5 to +5.5V
Current consumption with no load attached
3 mA
1
0.4V
1
CLKOUT
output low voltage (5mA load)
0.75V
1
CLKOUT
output low voltage (25mA load)
CLKOUT
output high voltage (5mA source)
VDD-0.7V
1
CLKOUT
output source current max
25mA
1
CLKOUT
output sink current max
25mA
1
NOTES:
1. Those values are characterized but not tested
.
5.0
Ordering information.
HTC5 5 5XX
OPTIONAL: Temperature range:
C = 0
o
C to +70
o
C , I = - 40
o
C to + 85
o
C.
PACKAGE:
S – 208 mil SOIC
D – 300 mil PDIP.
PART NUMBER.
01/04/00
3
HIGH TECH
CHIPS, INC.
6.0 Mechanical information.
8-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
Units
INCHES*
MILLIMETERS
Dimension Limits MIN
NOM
MAX
MIN
NOM
MAX
Number of Pins
n
8
8
Pitch
p
.100
2.54
Top to Seating Plane
A
.140
.155
.170
3.56
3.94
4.32
Molded Package Thickness
A2
.115
.130
.145
2.92
3.30
3.68
Base to Seating Plane
A1
.015
0.38
Shoulder to Shoulder Width E
.300
.313
.325
7.62
7.94
8.26
Molded Package Width
E1
.240
.250
.260
6.10
6.35
6.60
Overall Length
D
.360
.373
.385
9.14
9.46
9.78
Tip to Seating Plane
L
.125
.130
.135
3.18
3.30
3.43
Lead Thickness
c
.008
.012
.015
0.20
0.29
0.38
Upper Lead Width
B1
.045
.058
.070
1.14
1.46
1.78
Lower Lead Width
B
.014
.018
.022
0.36
0.46
0.56
Overall Row Spacing
eB
.310
.370
.430
7.87
9.40 10.92
Mold Draft Angle Top
5
10
15
5
10
15
Mold Draft Angle Bottom
5
10
15
5
10
15
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash protrusions. Mold flash or protrusions shell
not exceed .010” (0.254mm)per side.
JEDEC Equivalent:MS-001
01/04/00
4
HIGH TECH
CHIPS, INC.
8-Lead Plastic Small Outline (SM) – Medium, 208 mil (SOIC)
Units
INCHES
*
MILLIMETERS
Dimension Limits MIN
NOM
MAX
MIN
NOM MAX
Number of Pins
n
8
8
Pitch
P
.050
1.27
Overall Height
A
.070
.075
.080
1.78
1.97 2.03
Molded Package Thickness A2
.069
.074
.078
1.75
1.88 1.98
Standoff
A1
.002
.005
.010
0.05
0.13 0.25
Overall Width
E
.300
.313
.325
7.62
7.95 8.26
Molded Package Width
E1
.201
.208
.212
5.11
5.28 5.38
Overall Length
D
.202
.205
.210
5.13
5.21 5.33
Foot Length
L
.020
.025
.030
0.51
0.64 0.76
Foot Angle
0
4
8
0
4
8
Lead Thickness
c
.008
.009
.010
0.20
0.23 0.25
Lead Width
B
.014
.017
.020
0.36
0.43 0.51
Mold Draft Angle Top
0
12
15
0
12
15
Mold Draft Angle Bottom
0 12
15
0
12
15
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash protrusions. Mold flash or
protrusions shell not exceed .010” (0.254mm)per side.
01/04/00
5
[ Pobierz całość w formacie PDF ]